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| H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features * Improved Reliability Through Elimination of Internal Wire Bond * -40 to 85C Operating Temperature Range * Small Size * Industry Standard Footprint * Diffused Optics * Compatible with IR Solder Process * Four Colors Available * Available in 8 mm Tape on 7" (178 mm) Diameter Reels Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved. The HSMX-H670 and HSMX-H690 are available in four colors. The HSMX-H670 adheres to the industry standard 2.0 x 1.25 mm footprint and is intended for designs where space is limited. The small size, low 1.1 mm profile and wide viewing angle make these LEDs excellent for backlighting applications and front panel illumination. The HSMX-H690 adheres to the 1.6 x 0.8 mm Applications * Keypad Backlighting * LCD Backlighting * Symbol Backlighting * Front Panel Indicator industry standard footprint. The low 0.6 mm profile make this excellent for designs where space is limited. Both packages are compatible with IR and convective reflow soldering processes. Device Selection Guide Footprint (mm)[1][2] 1.6 x 0.8 x 0.6 2.0 x 1.25 x 1.1 High Efficiency Red HSMS-H690 HSMS-H670 Orange HSMD-H690 HSMD-H670 Yellow HSMY-H690 HSMY-H670 Green HSMG-H690 HSMG-H670 Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. Package Dimensions HSMX-H670 Series CATHODE MARK POLARITY HSMX-H690 Series POLARITY 2.00 (0.079) 1.27 (0.050) 1.10 (0.043) 1.25 (0.049) 0.50 (0.020) 0.40 (0.016) 0.40 (0.016) 0.48 (0.019) NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, 0.1 mm ( 0.004 INCH). 3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD - 0.05 MICRONS, NICKEL - 3 MICRONS, COPPER -18 MICRONS. , 1.00 1.60 0.60 0.30 0.80 TOPSIDE CATHODE MARK BOTTOMSIDE CATHODE MARK Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current[1] Power Dissipation Reverse Voltage (IR = 100 A) Operating Temperature Range Storage Temperature Range[2] HSMX-H670 20 50 5 -40 to +85 -40 to +85 HSMX-H690 20 50 5 -40 to +85 -40 to +85 Units mA mW V C C Notes: 1. Derate linearly as shown in Figure 4 for temperatures above 25C. 2. Maximum temperature for tape and reel packaging is 60C. Optical Characteristics at TA = 25C Luminous Intensity Peak IV (mcd) Wavelength @ IF = 20 mA[1] peak (nm) Min. Typ. Typ. 1.6 1.6 1.6 4.0 5.0 4.0 5.0 9.0 639 606 584 566 Color, Viewing Dominant Angle Wavelength 21/2 d[2] (nm) Degrees[3] Typ. Typ. 626 604 586 571 165 165 165 165 Luminous Efficacy v (lm/W) Part Number HSMS-H6X0 Color High Efficiency Red Orange Yellow Green 145 380 500 595 HSMD-H6X0 HSMY-H6X0 HSMG-H6X0 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength d is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 2.0 2.0 2.1 2.3 2.6 2.6 2.6 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 6 5 5 5 Thermal Resistance RJ-PIN (C/W) 250 250 250 250 Part Number HSMS-H670 HSMS-H690 HSMD-H670 HSMD-H690 HSMY-H670 HSMY-H690 HSMG-H670 HSMG-H690 Color High Efficiency Red Orange Yellow Green Green Color Bins[1] Bin ID A B C D E F G H J Minimum (nm) 561.0 564.0 567.0 570.0 573.0 561.0 564.0 567.0 570.0 Maximum (nm) 565.0 568.0 571.0 574.0 577.0 568.0 571.0 574.0 577.0 Notes Bin A & Bin B Bin B & Bin C Bin C & Bin D Bin D & Bin E Yellow Color Bins[1] Bin ID A B C D E F G H J Minimum (nm) 581.5 584.0 586.5 589.0 581.5 584.0 586.5 591.5 594.0 Maximum (nm) 585.0 587.5 590.0 592.5 587.5 590.0 592.5 595.0 597.5 Notes Bin A & Bin B Bin B & Bin C Bin C & Bin D Luminous Intensity Bin Limits[1] Bin ID A B C D E F G H J K L M N P Q R S T U V W X Y Minimum (med) 0.10 0.16 0.25 0.40 0.63 1.00 1.60 2.50 4.00 6.30 10.00 16.00 25.00 40.00 63.00 100.00 160.00 250.00 400.00 630.00 1000.00 1600.00 2500.00 Maximum (med) 0.20 0.32 0.50 0.80 1.25 2.00 3.20 5.00 8.00 12.50 20.00 32.00 50.00 80.00 125.00 200.00 320.00 500.00 800.00 1250.00 2000.00 3200.00 5000.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Hewlett-Packard representative for information on currently available bins. 1.0 GREEN ORANGE RELATIVE INTENSITY HIGH EFFICIENCY RED 0.5 YELLOW 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength. 20 IF - FORWARD CURRENT - mA 1.2 YELLOW ORANGE 15 HER GREEN 10 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.0 0.8 0.6 0.4 0.2 0 5 0 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 VF - FORWARD VOLTAGE - V IDC - DC FORWARD CURRENT - mA Figure 2. Forward Current vs. Forward Voltage. Figure 3. Relative Luminous Intensity vs. DC Forward Current. 40 IF - FORWARD CURRENT - mA 20 30 40 50 10 0 1.0 35 30 25 20 15 10 .8 .6 60 70 80 .4 .2 5 0 0 20 40 60 80 100 90 10 20 30 40 50 60 70 80 90100 ANGLE TA - AMBIENT TEMPERATURE - C Figure 4. Maximum DC Current vs. Ambient Temperature. Figure 5. Intensity vs. Angle. NORMALIZED INTENSITY 0.8 (0.031) 0.80 0.85 0.80 10 SEC. MAX. 230C MAX. TEMPERATURE HSMX-H690 SERIES 4C/SEC. MAX. 1.1 (0.043) 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 1.25 (0.049) 1.1 (0.043) 1.25 (0.049) HSMX-H670 SERIES Figure 6. Recommended Reflow Soldering Profile. Figure 7. Recommended Solder Patterns. USER FEED DIRECTION CATHODE SIDE PRINTED LABEL 2.0 (0.08) Figure 8. Reeling Orientation. LABEL 60 Figure 9. Reel Dimensions. NOTE: ALL DIMENSIONS IN MILLIMETERS (INCHES). , , , , 21.0 (0.83) 60 1.5 TYP. (0.06) 180 O (7.08) 60.0 O (2.36) O 13.0 (0.51) 13.0 (0.51) 10.0 (0.39) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) ,, ,,,,, , , ,,,,, 4.00 0.10 (0.157 0.004) 1.50 + 0.10 0 O (0.059 + 0.004) 0 CATHODE 1.30 0.10 (0.051 0.004) 1.75 0.10 (0.069 0.004) 3.50 0.05 (0.138 0.002) 8.00 0.30 (0.315 0.012) USER FEED DIRECTION CARRIER TAPE COVER TAPE 4.00 0.10 (0.157 0.004) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMX-H670 SERIES HSMX-H690 SERIES DIM. A DIM. B 0.10 (0.004) 0.10 (0.004) 2.40 (0.094) 1.98 (0.078) 1.60 (0.064) 1.02 (0.040) START THERE SHALL BE A MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. 150 mm-360 mm (5.9 - 14.2 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. 0.20 0.05 (0.008 0.002) Figure 10. Tape Dimensions. END MOUNTED WITH THERE SHALL BE A COMPONENTS MINIMUM OF 40 mm (1.57 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 11. Tape Leader and Trailer Dimensions. Convective IR Reflow Soldering For information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMI LED Indicator Components. H For technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 Far East/Australasia: (65) 290-6305 Japan: (81 3) 3331-6111 Europe: Call your local HP sales office listed in your telephone directory. Ask for a Components representative. Data subject to change. Copyright (c) 1996 Hewlett-Packard Co. Printed in U.S.A. 5965-1521E (5/96) |
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